{"product_id":"rapid-thermal-processing-for-future-semiconductor-devices-0444513396","title":"Rapid Thermal Processing for Future Semiconductor Devices","description":"\u003cp\u003e\u003cstrong\u003eISBN:\u003c\/strong\u003e 0444513396\u003c\/p\u003e\u003cp\u003e\u003cstrong\u003eAuthor:\u003c\/strong\u003e Fukuda, H.\u003c\/p\u003e\u003cp\u003e\u003cstrong\u003eCondition:\u003c\/strong\u003e New\u003c\/p\u003e\u003cp\u003eThis volume is a collection of papers which were presented at the 2001 International Conference on Rapid Thermal Processing (RTP 2001) held at Ise Shima, Mie, on November 14-16, 2001. This symposium is second conference followed the previous successful first International RTP conference held at Hokkaido in 1997. The RTP 2001 covered the latest developments in RTP and other short-time processing continuously aiming to point out the future direction in the Silicon ULSI devices and II-VI, III-V compound semiconductor devices.This book covers the following areas: advanced MOS gate stack, integration technologies, advancd channel engineering including shallow junction, SiGe, hetero-structure, novel metallization, inter-connect, silicidation, low-k materials, thin dielectrics including gate dielectrics and high-k materials, thin film deposition including SiGe, SOI and SiC, process and device modelling, Laser-assisted crystallization and TFT device fabrication technologies, temperature monitoring and slip-free technologies.\u003c\/p\u003e","brand":"Mia Karts","offers":[{"title":"Default Title","offer_id":51943989248288,"sku":"NEW0444513396","price":164.4,"currency_code":"USD","in_stock":false}],"url":"https:\/\/miakarts.com\/products\/rapid-thermal-processing-for-future-semiconductor-devices-0444513396","provider":"Miakarts Books","version":"1.0","type":"link"}