{"product_id":"reliability-of-rohs-compliant-2d-and-3d-ic-interconnects-electronic-engineering-0071753796","title":"Reliability of RoHS-Compliant 2D and 3D IC Interconnects (Electronic Engineering)","description":"\u003cp\u003e\u003cstrong\u003eISBN:\u003c\/strong\u003e 0071753796\u003c\/p\u003e\u003cp\u003e\u003cstrong\u003eAuthor:\u003c\/strong\u003e Lau, John H.\u003c\/p\u003e\u003cp\u003e\u003cstrong\u003eCondition:\u003c\/strong\u003e New\u003c\/p\u003e\u003cp\u003ePublisher's Note: Products purchased from Third Party sellers are not guaranteed by the publisher for quality, authenticity, or access to any online entitlements included with the product.Proven 2D and 3D IC lead-free interconnect reliability techniquesReliability of RoHS-Compliant 2D and 3D IC Interconnects offers tested solutions to reliability problems in lead-free interconnects for PCB assembly, conventional IC packaging, 3D IC packaging, and 3D IC integration. This authoritative guide presents the latest cutting-edge reliability methods and data for electronic manufacturing services (EMS) on second-level interconnects, packaging assembly on first-level interconnects, and 3D IC integration on microbumps and through-silicon-via (TSV) interposers. Design reliable 2D and 3D IC interconnects in RoHS-compliant projects using the detailed information in this practical resource.Covers reliability of: 2D and 3D IC lead-free interconnects CCGA, PBGA, WLP, PQFP, flip-chip, lead-free SAC solder joints Lead-free (SACX) solder joints Low-temperature lead-free (SnBiAg) solder joints Solder joints with voids, high strain rate, and high ramp rate VCSEL and LED lead-free interconnects 3D LED and 3D MEMS with TSVs Chip-to-wafer (C2W) bonding and lead-free interconnects Wafer-to-wafer (W2W) bonding and lead-free interconnects 3D IC chip stacking with low-temperature bonding TSV interposers and lead-free interconnects Electromigration of lead-free microbumps for 3D IC integration\u003c\/p\u003e","brand":"Mia Karts","offers":[{"title":"Default Title","offer_id":51664016605472,"sku":"NEW0071753796","price":111.34,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0980\/7426\/3840\/files\/61A99TbSrnL.jpg?v=1778875984","url":"https:\/\/miakarts.com\/products\/reliability-of-rohs-compliant-2d-and-3d-ic-interconnects-electronic-engineering-0071753796","provider":"Miakarts Books","version":"1.0","type":"link"}