{"product_id":"wire-bonding-in-microelectronics-materials-processes-reliability-and-yield-0070326193","title":"Wire Bonding in Microelectronics: Materials, Processes, Reliability, and Yield","description":"\u003cp\u003e\u003cstrong\u003eISBN:\u003c\/strong\u003e 0070326193\u003c\/p\u003e\u003cp\u003e\u003cstrong\u003eAuthor:\u003c\/strong\u003e Harman,George\u003c\/p\u003e\u003cp\u003e\u003cstrong\u003eCondition:\u003c\/strong\u003e New\u003c\/p\u003e\u003cp\u003eThe wire bonding bible - now revised and expanded! Get the practical know-how you need to design and evaluate wire bonds engineered with the latest - and still-evolving- metallurgies. Extensively revised and updated, the Second Edition of George Harman's classic Wire Bonding in Microelectronics shows you step-by-step how to exploit new higherm density interconnection techniques and engineer reliable gonds at a very high yield. You get the hands-on guidance you need to test wire bonds...clean bond pads to improve bondability and realiability...solve cratering, heel cracks, bond fatigue, so-called purple plague and other mechanical problems....bond wires to multichip modules...and much, much more. You also get up-to-the-minute details on utilizing fine pitch SMT, applying new bonding metallurgies, and exploring wire sweep and the wire bonding mechanism.\u003c\/p\u003e","brand":"Mia Karts","offers":[{"title":"Default Title","offer_id":51894995386656,"sku":"NEW0070326193","price":168.0,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0980\/7426\/3840\/files\/518e_WaoGmL.jpg?v=1782029090","url":"https:\/\/miakarts.com\/products\/wire-bonding-in-microelectronics-materials-processes-reliability-and-yield-0070326193","provider":"Miakarts Books","version":"1.0","type":"link"}