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Stress Induced Phenomena in Metallization: Sixth International Workshop on Stress Induced Phenomena in Metallization, Ithaca, New York, 25-27 July 2001 (AIP Conference Proceedings, 612)
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ISBN: 073540058X
Author: Baker, Shefford P.
Condition: New
Tiny metal structures, less than a millionth of a metre across, are critical building blocks in a number of high-tech devices such as computer chips. These metallizations are subjected to extreme conditions of temperature, electric current density and mechanical load, which may cause the device they are in to fail. This book contains research papers on these metallizations and on the reliability problems associated with them. The papers were peer reviewed for these proceedings.
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Stress Induced Phenomena in Metallization: Sixth International Workshop on Stress Induced Phenomena in Metallization, Ithaca, New York, 25-27 July 2001 (AIP Conference Proceedings, 612)